Taking Atoms to Systems in Next-Generation SoC Designs
June 25, 2019
New system-on-chip (SoC) devices are driving new memory architectures and photonic interfaces, while specialized new intellectual property (IP) requires analysis down to the nanometer and atomic levels because of single nanometer process nodes....
3D Heterogeneous Integration Drives Demand for New Materials and Integration Solutions
October 2, 2018
SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two talked in the runup to his presentation at the Advanced...