MEMS and Image Sensors Trends in the Age of COVID-19
MEMS and image sensors are shining stars in the chip industry as technology companies worldwide accelerate innovation in the fight against COVID-19. The tiny devices are behind advances in areas of electronics ranging from thermal imaging and faster...
Workshop: Get Started with Flexible Hybrid Electronics
The combination of state-of-the-art semiconductor devices and upcoming manufacturing technologies for cost-effective processing of flexible film substrates has paved the way for a large variety of new applications in the emerging Flexible Hybrid...
A New Collaborative Approach to Automobile Industry Reliability Challenges
SEMI spoke with Antoine Amade, Regional Senior Director EMEA at Entegris, about the challenges set by the car industry, and the concept of “zero defect” and the need for a collaborative approach ahead of his presentation at the Strategic Materials...
MEMS – One Product, One Process?
SEMI spoke with Udo Gómez, senior vice president at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of MEMS technology development and manufacturing...
Wafer-Level Chip Scale Packages: Reliability and Validation Testing Using Simulation Methodology
SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference
3D Heterogeneous Integration Drives Demand for New Materials and Integration Solutions
SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two talked in the runup to his presentation at the Advanced...