Industry Giants TSMC and Intel Vow to Focus on 3D IC Packaging
June 26, 2019
Post-Conference Report: SEMI Heterogeneous Integration Summit
A Glimpse into the Future at FLEX/MEMS & Sensors Technical Congress
March 7, 2019
A short trip to Monterey, California provided an exciting glimpse into what is in store for the future. Along with 550 attendees and 60 exhibitors, I took a quick visit through the aisles and conference venue to find several exciting developments...
FLEX & MSTC Recognize Outstanding Student Researchers
February 25, 2019
The recent FLEX 2019 and MEMS & Sensors Technical Congress (MSTC) showcased autonomous mobility sensors, more than 100 market and technical presentations, and 60 exhibits but also highlighted the industry’s future. The event also highlighted the...