Fan-Out System-in-Board Technology: Enabling RF and Processor Module and System-Level Integration
January 25, 2019
SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summit in Dresden, Germany.
Agile Manufacturing of Glass Carriers for Advanced Packaging
January 18, 2019
SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus. We also talked about the impact of this work on...
Zero Energy Connection (0eC) - A New Way to Transfer Data
January 17, 2019
SEMI met with Erez Halahmi, vice president at 0eC SA, to discuss a new way to transfer information not only between chips but also between servers to reduce power consumption while boosting performance. The two spoke ahead of his presentation at the...