Fan-Out System-in-Board Technology: Enabling RF and Processor Module and System-Level Integration
January 25, 2019
SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summit in Dresden, Germany.
3D Heterogeneous Integration Drives Demand for New Materials and Integration Solutions
October 2, 2018
SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two talked in the runup to his presentation at the Advanced...