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Technology and Trends

Speeding MEMS Innovation and Production

DARPA’s Vision of Cross-Collaboration

Ron Polcawich, program manager, DARPA Microsystems Technology Office, will give the closing keynote at MEMS & Sensors Executive Congress on October 29-30, 2018 in Napa, Calif. SEMI’s Nishita Rao spoke with...

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Autonomy Value — The Next Value for Sensors Suppliers

Nicolas Sauvage, senior director of Ecosystem at TDK InvenSense, will present at the fast-approaching MEMS & Sensors Executive Congress on October 29-30, 2018 in Napa, Calif. SEMI’s Nishita Rao spoke with Sauvage to offer MSEC attendees advance...

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Top 3 Reasons to Attend MEMS & Sensors Executive Congress 2018

You’re super busy. We know - it’s hard to take time away from work. So an industry conference must offer compelling value to justify your time.  

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ULVAC and the CIA: A Sensing Story about Food and Agriculture

ULVAC Technologies’ David Mount is working with The CIA. Is he the Jack Reacher of the MEMS and sensors industry, jetting around the world to secret meetings, you wonder? While David isn’t quite the super-spy that you might have imagined, he is...

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Cybersecurity Critical to Success of MEMS and Sensors Suppliers

Cynthia Wright, a retired military officer with over 25 years of experience in national security and cyber strategy and policy, now Principal Cyber Security Engineer at The MITRE Corporation, will give the opening keynote at the upcoming MEMS &...

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MEMS – One Product, One Process?

SEMI spoke with Udo Gómez, senior vice president at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of MEMS technology development and manufacturing...

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Automating 200mm Semiconductor Fabs to Meet Growing Demand

SEMI met with Heinz Martin Esser, managing director at Fabmatics GmbH, to discuss how existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality pressure by implementing intralogistics...

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Wafer-Level Chip Scale Packages: Reliability and Validation Testing Using Simulation Methodology

SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference

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3D Heterogeneous Integration Drives Demand for New Materials and Integration Solutions

SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two talked in the runup to his presentation at the Advanced...

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SEMI Korea Members Day: Takeaways and Tech Trends as Korea Leads in Fab Investment

Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerhouses Samsung Electronics Co. and SK Hynix leading the way, according to latest World Fab Forecast Report by SEMI. Samsung...

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