SEMI met with Heinz Martin Esser, managing director at Fabmatics GmbH, to discuss how existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality pressure by implementing intralogistics...
Recent Posts
Wafer-Level Chip Scale Packages: Reliability and Validation Testing Using Simulation Methodology
October 8, 2018
SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference
3D Heterogeneous Integration Drives Demand for New Materials and Integration Solutions
October 2, 2018
SEMI met with Gerald Beyer, program manager at imec, to discuss the co-existence of various 3D interconnect technologies and their need for new materials and integration solutions. The two talked in the runup to his presentation at the Advanced...
Making Wearables Always Wearable With MEMS Sensor Technology
July 30, 2018
Ahead of his presentation on the future of wearables at the European MEMS & Sensors Summit 2018, 19-21 September in Grenoble, France, SEMI spoke with Dr. Peter Weigand, vice president, Business Strategy and Portfolio Management, Bosch Sensortec...