Not rendering correctly? View this email as a web page here.
StandardsWatchEmailhdr.jpg
Volume 12, Issue 4
James-Amano85w.jpg
From the Director's Desk
James Amano, Senior Director

Automating Electron Microscopy Workflow
New activity seeks to standardize form factor and geometric dimensions of lamella carriers. Read More
Newly Formed Fan-Out Panel Level Packaging (FO-PLP) Panel Task Force
Standardization is required to facilitate the transition to high volume manufacturing. Read More
EU Awards
SEMI honored three industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. Read More
Equipment Idle Mode
Fabs are dropping their expenses – by demanding their equipment be idle. Read More
Revision to SEMI E142, Specification for Substrate Mapping
The importance of back-end processing is greater than ever. Read More
How to Tame the Electromagnetic Interference in the Fabs and Beyond
Electromagnetic interference (EMI) is an increasingly important topic across the global electronics manufacturing supply chain. Read More
New SNARF: Test Method for Extension of Flexible Thin Film PV Modules
Given the uniqueness of the flexible thin film PV modules, it is important to evaluate the extension durability. Read More
China PV Update October 2017
The SEMI China PV Standards TC Chapter Fall Meeting 2017 was successfully held in Jiangyan, Taizhou, Jiangsu. Read More
Standards Calendar
December 12-15
Standards Meetings at SEMICON Japan 2017
February 1-2
Standards Meetings at SEMICON Korea 2018
April 9-12
North America Standards Spring 2018 Meetings

Get Your 30-Day SEMIViews Trial!*