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Volume 12, Issue 3
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From the Director's Desk
James Amano, Senior Director

New 3D Packaging & Integration Committee
Furthering the advance of new, innovative semiconductor packaging technologies. Read More
Survey on Fan-Out Panel Level Packaging Standardization
Help guide the direction of Standards activity. Read More
New Electron Microscopy Workflow TF Formed
Keeping up with demand for Electron Microscopy in semiconductor manufacturing. Read More
Awards at SEMICON West
SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. Read More
SEMI E175-1116: Specification for Subsystem Energy Saving Mode Communication (SESMC)
Saving energy and cutting costs. Read More
SEMI A1: Specification for Horizontal Communication Between Equipment for Factory Automation System
Equipment communication protocol for flow shop style manufacturing. Read More
PCB ECI SNARF
New activity to define equipment communication interface for PCB manufacturing. Read More
S8 Ergonomics Revision
Significant updates to critical ergonomics standard. Read More
New Display Standard: Test Method of Color Reproduction and Perceptual Contrast
Advanced image quality evaluation method. Read More
Standards Calendar
November 6-9
North America Standards Fall 2017 Meetings
November 14-15
Standards Meetings at SEMICON Europa 2017

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