Standard for Fan-Out Panel Size Ready to Ballot
August 28, 2018
The arrival of Fan-Out Panel Level Packaging (FO-PLP) appears to be at a perfect time: This technology will leverage processes developed for Three Dimensional Stacked Integrated Circuits (3DS-IC) as well as panel processing technologies developed...
U.S. Federal Government Finalizes R&D Spending for 2018
April 6, 2018
Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year. Congressional spending has been...