Metrology and Inspection Challenges at 5nm and Beyond
By
Debra Vogler
June 13, 2018
The Scaling Technologies TechXPOT at this year’s SEMICON West (Scaling Every Which Way! – Thursday, July 12, 2:00pm-4:00pm) will explore traditional scaling as the industry marches toward 3nm and beyond, as well as technologies that enable 3D...
Getting to 3nm: It Really is Scaling Every Which Way!
By
Debra Vogler
June 11, 2018
With chipmakers looking toward 5nm manufacturing, it’s clear that traditional scaling is not dead but continuing in combination with other technologies. The industry sees scaling enabled by 3D architectures such as die stacking and the stacking of...
SEMICON West Preview: Smart Microelectronics Manufacturing Builds the Infrastructure to Enable AI Applications
By
Paula Doe
June 7, 2018
The fast-maturing hardware and software that are enabling practical applications of equipment intelligence and machine learning mean disruptive change for microelectronics manufacturing. But first comes the basic work of building the basic...